Key Process Flow of Rigid-Fled PCB Production

The birth and development of FPC and PCB have created this new product- Rigid-flex PCB board; therefore, it is a printed circuit board, which combines an FPC( flexible printed circuit) with a rigid circuit board by pressing or laminating processes, and according to the relevant technical requirements to form a circuit board having FPC characteristics and PCB characteristics.

FPC Circuit Board Production

• cutting： Cut the flex PCB material(Learn more PCB fabrication material) (FCCL/cover film/pure rubber, etc.) into the PNL size we need for PCB processing.
• FPC lamination: Pressing the FPC board together with a specific temperature and pressure through a Bonding sheet to form an FPC layer stack.
• Blacking the hole: Through the black hole method, a layer of charged carbon powder is attached to the hole wall to realize the hole wall’s metallization for subsequent copper plating.
• FPC Board plating: To make the hole wall plate with a standard copper thickness to achieve electrical signal conduction between layers.
• FPC exposure: To achieve FPC graphic image transfer through the dry film/exposure principle.
• FPC etching: Acid etching is used to remove the copper layer’s FPC patterner.
• Plasma degumming: mixing a certain proportion of gas in a vacuum chamber to achieve a vacuum plasma state to meet the purpose of soft board removal or film surface roughening.

Pressing or Lamination Process

• Stick covering film: protect the copper surface of the FPC board substrate and increase the folding resistance of the FPC board.
• Fast laminating: pressing the film at a high temperature for a short period, bonding the cover film to the copper surface of the FPC board substrate to enhance the viscosity of the cover film and the FPC board.
• Browning: to roughen the surface of the copper through the chemical syrup to increase the bonding force between the FPC board and the rigid board.
• Pressing or laminating: bonding the FPs and rigid boards together by high temperature and high pressure.

Opening Process

• Core board: The UV laser controls the deep Core board and the outer layer control depth to form the opening section to achieve the opening design.
• Routing opening slot: through mechanical forming, form a closed path with the outer layer to achieve the opening design.
• Laser depth control: open the cover of the thin cover sheet by UV laser depth control.
• Mechanical control depth: through the mechanical control depth, the outer cover of the thick cover piece is realized.

The advantages of our factory to fabrication rigid-flex PCB boards

1. More than 9 years of PCB manufacturing experience, with over 8 years of experience in Rigid-flex PCB production.
2. Advanced CCD hot melt equipment and automated laminating equipment, Strong manufacturing process capability of laminating.
3. LDI can produce printed circuit boards with 30/30um trace width & trace spacing, precise alignment accuracy.
4. The plasma and browning process can increase the bonding between FPC and Rigid PCB boards.
5. With UV cutting, we can deliver quickly.
6. Unique technical advantages in the opening process.