| 1 |
PCB Layers |
1 – 12 layers |
| 2 |
Laminate | Material |
Flexible part: DuPont PI, Shengyi PI |
| Rigid part: PI/FR4 |
| FR4, for lead-free welding |
| low-loss material |
| Halogen free |
| Special materials: Rogers/Arlon/Nelco/Taconic etc |
| PTFE |
| Polyimide |
| 3 |
Delivery Size |
Delivery Size |
570X610mm |
570X610mm |
| Production size |
610X640mm |
610X640mm |
| 4 |
Board Thickness |
thinnest |
0.25 mm |
0.20 mm |
| thickest |
5.00 mm |
5.50 mm |
| 5 |
Finished board thickness tolerance |
±2mil(±0.04m) |
| 6 |
Copper Thickness |
Inner Layer |
1/3-28 OZ |
1/3-30 OZ |
| Outer Layer |
1/7-28 OZ |
1/7-30 OZ |
| 7 |
Inner Line |
Minimum line width |
50μm |
50μm |
| Minimum line spacing |
75μm |
50μm |
| 8 |
Outer Line |
Minimum line width |
75μm |
50μm |
| Minimum line spacing |
75μm |
50μm |
| 9 |
Min. mechanical Via hole, minimum pad |
inner Layer |
0.45 mm |
0.40 mm |
| Outer Layer |
0.40 mm |
0.35 mm |
| 10 |
Laser Via hole minimum pad |
inner Layer |
0.25 mm |
0.23 mm |
| Outer Layer |
0.25 mm |
0.23 mm |
| 11 |
Thickness to diameter ratio |
LBMV |
1:1 |
1:1 |
| MVTH |
1:12 |
1:16 |
| 12 |
Min. dielectric thickness |
Inner core board |
0.025 mm |
0.025 mm |
| Prepreg |
0.05 mm |
0.05 mm |
| 13 |
Solder resist |
min. spacing |
60 μm |
40 μm |
| Min. Solder resist bridge |
75 μm |
65 μm |
| 14 |
Buried capacitance |
Insulation thickness: 14 μm |
| unit-area capacitance: 6.4 nF/in2 |
| Breakdown voltage: >100V |
| 15 |
Buried resistor |
Resistance per unit area(ohms/sq.) : 25, 50, 100, 200 |
| 16 |
Impedance control accuracy |
10% |
5% |
| 17 |
Plug hole |
ink plughole |
| resin plug holes |
| copper slurry plughole |
| 18 |
Min Tracing/Spacing |
2.5mil/2.5mil |
| 19 |
Min. Annular Ring |
4mil |
| 20 |
Min. Drilling Hole Diameter |
8mil(0.15mm) |
| 21 |
Min. mechanical drilling |
0.15 mm |
0.15 mm |
| 22 |
Laser aperture |
0.10-0.2 0mm |
0.10-0.20 mm |
| 23 |
Min. finished via diameter |
6mil(0.15mm) |
| 24 |
Tolerance of dimension |
3mil(0.076 mm) |
| 25 |
Solder Mask Color |
Green, White, Blue, Black, Red, Yellow |
| 26 |
Silkscreen Color |
White, Black, Yellow |
| 27 |
Surface Finish |
OSP |
| HASL(Hot Air Solder Leveling) |
| HASL Lead-Free |
| Flash Gold |
| ENIG (Electroless Nickle/Immersion Gold) |
| Immersion Tin |
| Immersion Silver |
| 28 |
Special technologies |
Impedance Control+/-10% |
| Gold fingers |
| Stiffener (PI/FR4) |
| Peelable solder mask |
