HDI PCB Board Fabrication Capabilities
With the development of society, the progress of technology comes from people’s constant pursuit of life and their yearning for a higher quality of life. Personal consumer electronic products such as notebook computers, personal computers, and mobile phones require lighter weight and smaller volume, while smaller volume requires smaller design accuracy and higher density. At the same time, the quality and speed of interconnection technology should be better. This requires designers who make these products to design better components to improve electrical performance, such as circuit boards and so on.
In order to manufacture PCB products of this kind, PCB manufacturers need more advanced manufacturing technology. Of course, from the point of view of the product cost, it needs a lower cost. This seems contradictory, but HDI PCB can solve this problem very well. HDI PCB has numerous advantages, such as high speed, small size, and high frequency.
Home » PCB Manufacturing Capabilities » HDI PCB Board Fabrication Capabilities
HDI Structures | Type of Micro vias | Mass Production | Small-Middle Batch | Prototype | Available |
---|---|---|---|---|---|
1+N+1 | Blind vias | Yes | Yes | Yes | 4 layers+ |
2+N+2 | Blind/Buried | Yes | Yes | Yes | 6 layers+ |
staggered vias | |||||
2+N+2 | Blind/Buried | Yes | Yes | Yes | 6 layers+ |
stacked vias | |||||
3+N+3 | Blind/Buried | / | Yes | Yes | 8 layers+ |
staggered vias | |||||
3+N+3 | Blind/Buried | / | / | Yes | 8 layers+ |
stacked vias |
NO. | Feature | Capability |
---|---|---|
1 | Quality Grade | Standard IPC 2 |
2 | Number of Layers | 4 – 24layers |
3 | Order Quantity | 1pc – 10000+pcs |
4 | Build Time | 2days – 5weeks |
5 | Material | FR4 standard Tg 140°C | FR4 High Tg 170°C | FR4 and Rogers combined lamination |
6 | Board Size | Min 6*6mm | Max 457*610mm |
7 | Board Thickness | 0.4mm – 3.0mm |
8 | Copper Weight (Finished) | 0.5oz – 2.0oz |
9 | Min Tracing/Spacing | 2.5mil/2.5mil |
10 | Solder Mask Sides | As per the file |
11 | Solder Mask Color | Green | White | Blue | Black | Red | Yellow |
12 | Silkscreen Sides | As per the file |
13 | Silkscreen Color | White | Black | Yellow |
14 | Surface Finish | HASL – Hot Air Solder Leveling |
Lead Free HASL – RoHS | ||
ENIG – Electroless Nickle/Immersion Gold – RoHS | ||
Immersion Silver – RoHS | ||
Immersion Tin – RoHS | ||
OSP – Organic Solderability Preservatives – RoHS | ||
15 | Min Annular Ring | 4mil, 3mil – laser drill |
16 | Min Drilling Hole Diameter | 6mil, 4mil – laser drill |
17 | Max Exponents of Blind/Buried Vias | stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected |
18 | Other Techniques | Rigid-flex combination |
Via In Pad | ||
Buried Capacitor (only for Prototype PCB total area ≤1m²) |